MECHANIC Solder Pasta XGSP30 20g -183 °C
MECHANIC solder paste XGSP30 solder paste BGA SMT mobile phone chip repair flux XGSP30 Medium temperature flux
Description
Model: XGSP30
Viscosity: 50 (Pa·S)
Particle size: 25-55 (um)
Alloy composition: tin lead
Activity: Medium
Type: Lead solder paste Cleaning
angle: no need to clean Melting
point: 183 (°C)
Type: Chip Solder Paste Working temperature: 280 (°C)
Tin-lead ratio: 63SN / 37PB
Scope of application: mobile phone chip repair computer or home appliance chip patch repair BGA special products
