MECHANIC Solder Pasta XGSP40 35g -183 °C

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Product Specifications

Type: XGSP40

Alloy: Sn63/Pb37.

Microns: 20-38um. Melting point:183°C


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Application: for BGA motherboard soldering iron station flux cream.

Function: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc. Hi-Preformance.