MECHANIC Solder Pasta XGSP30 20g -183 °C

Login to view prices

MECHANIC solder paste XGSP30 solder paste BGA SMT mobile phone chip repair flux XGSP30 Medium temperature flux

Categories: , Tags: ,


Model: XGSP30

Viscosity: 50 (Pa·S)

Particle size: 25-55 (um)

Alloy composition: tin lead

Activity: Medium

Type: Lead solder paste Cleaning

angle: no need to clean Melting

point: 183 (°C)

Type: Chip Solder Paste Working temperature: 280 (°C)

Tin-lead ratio: 63SN / 37PB

Scope of application: mobile phone chip repair computer or home appliance chip patch repair BGA special products