MECHANIC Solder Pasta XGSP40 35g -183 °C
Product Specifications
Type: XGSP40
Alloy: Sn63/Pb37.
Microns: 20-38um. Melting point：183°C
Description
Application: for BGA motherboard soldering iron station flux cream.
Function: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc. Hi-Preformance.
